MoU with Intel

In pursuance to the above, Chairman (UGC) signed a Memorandum of Understanding (MoU) with President, Intel (India) on 16 Dec 2004 in the UGC Office at New Delhi.

The agreement is expected to expand and increasetechnology expertise amongst the various stakeholders in higher education in India.As per the understanding Intel will work closely with UGC in framing ICT standards for Higher Education. Intel has also committed to setting up an Innovation Centerjointly with UGC showcasing various technologies and solutions for education community.Intel will work towards building pilots on wireless campuses across some fifty Universitiesand Colleges during 2005. Intel would do this at its own cost.

Intel will also offer technology proof-points and support the UGC to work on pilots, proof-of-concepts and adoption. UGC and Intel together will work towards fostering a spirit of R&D in the Universities and Colleges and share best practices to create a higher adoption rate of new technologies. Intel will work with a consortium of Industry players in developing rapid deployable hardware packages to assist UGC’s initiatives on enhancing the reach of education and create an attractive package of hardware, connectivity, software & training offerings for Universities, Colleges and Students.

This is an enabling agreement and details of various activities will be decided with mutual consultation in due course.

Later , the Commission in its meeting held on 24.12.2004 ratified the decision of the Chairman (UGC) to enter into a MOU with Intel. In order to ensure there was total transparency, the Commission had decided the details of the MOU and the terms and conditions that were agreed to and signed with the Intel Corporation be publicized as widely as possible.
Click detailed text of MOU with Intel to see the full text of the MOU.